Which NEC article governs ground and bonding?

Which NEC article governs ground and bonding?

• A. NEC Article 250
• B. NEC Article 625
• C. NEC Article 110
• D. NEC Article 700

Answer: (A)

Grounding and bonding are safety steps that create a low-impedance path for fault current and keep all non-current-carrying metal parts at the same electrical potential, reducing shock risk and helping protective devices operate properly. The NEC dedicates a specific article to these topics, detailing how grounding electrodes and equipment grounding conductors are installed, sized, and connected, as well as how metallic enclosures, pipes, and other conductive parts must be bonded to maintain a common potential. This article also covers bonding of non-electrical parts like water and gas piping to ensure a unified ground reference throughout the system. Because it precisely defines the rules for grounding and bonding, it is the article that governs these practices.

Grounding and bonding are safety steps that create a low-impedance path for fault current and keep all non-current-carrying metal parts at the same electrical potential, reducing shock risk and helping protective devices operate properly. The NEC dedicates a specific article to these topics, detailing how grounding electrodes and equipment grounding conductors are installed, sized, and connected, as well as how metallic enclosures, pipes, and other conductive parts must be bonded to maintain a common potential. This article also covers bonding of non-electrical parts like water and gas piping to ensure a unified ground reference throughout the system. Because it precisely defines the rules for grounding and bonding, it is the article that governs these practices.